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http://www.buddies-tech.com BTM61 datasheet 1 BTM61 bluetooth module data sheet document type: bluetooth module datasheet document version: v1.01 release date: june 26, 2012 reproduction of this document, in part of in whole, by any means is prohibited without written permiss ion from buddies technology limited. the information co ntained herein is believed to be accurate as of the date of publication. however, buddies technolog y is not liable for any damages, including indirect or consequential from the use of software this document represents, or any reliance of the accuracy of this document. buddies technology reser ves the right to change the contents of this document at any time without notice. this document contains proprietary confidential tra de secrets and may be subject to additional restrictions contained in the licensing agreement u nder which this document was obtained.
http://www.buddies-tech.com BTM61 datasheet 2 revision history date version description author 2012-03-14 v1.0 first release 2012-06-26 v1.01 add uart port application notes
http://www.buddies-tech.com BTM61 datasheet 3 content 1. introduction.................................... ................................................... .......................................... 4 1.1 b lock d iagram ................................................... ................................................... ........................... 4 1.2 f eatures ................................................... ................................................... ...................................... 5 1.3 a pplications ................................................... ................................................... ............................... 6 2. general specification .......................... ................................................... ............................... 7 3. physical characteristic......................... ................................................... ........................... 8 3.1 pin description................................ ................................................... ................................................. 9 4. reference schematic ............................ ................................................... ............................. 12 5. physical interface??????? .??????????????????.?????????? ..13 5.1 p ower s upply ................................................... ................................................... ............................. .13 5.2 a udio i nterfaces ................................................... ................................................... .................................................13 5.2.1 adc ......................................... ................................................... ............................................... 13 5.2.2 adc sample rate selection and warping ....... ................................................... ...................... 14 5.2.3 adc gain..................................... ................................................... ........................................... 14 5.2.4 dac ......................................... ................................................... ............................................... 14 5.2.5 dac sample rate selection and warping ....... ................................................... ...................... 14 5.2.6 dac gain..................................... ................................................... ........................................... 14 5.2.7 mono operation .............................. ................................................... ........................................ 14 5.2.8 audio input stage............................ ................................................... ........................................ 15 5.2.9 microphone input ............................ ................................................... ....................................... ..15 5.2.10 audio output stage ......................... ................................................... ........................................ 15 5.3 rf i nterface ................................................... ................................................... .............................. 15 5.4 g eneral p urpose a nalog io ................................................ ................................................... ...... 15 5.5 g eneral p urpose d igital io ................................................ ................................................... ....... 15 5.6 s erial i nterfaces ................................................... ................................................... ...................... 16 5.6.1 uart ........................................ ................................................... .............................................. 16 5.6.2 spi ......................................... ................................................... .................................................. 16 6. electrical characteristic ...................... ................................................... ...................... 17 6.1 a bsolute m aximum r ating ................................................... ................................................... ..... 17 6.2 r ecommended o perating c onditions ................................................... ....................................... 17 6.3 i nput / output t erminal c haracteristics ................................................... ................................. 17 6.3.1 digital terminals............................ ................................................... ......................................... 17 6.3.2 internal codec - analogue to digital converte r ................................................. ....................18 6.3.3 internal codec - digital to analogue converte r ................................................. ....................18 6.3.4 microphone input ............................ ................................................... ........................................ 19 6.3.5 speaker output .............................. ................................................... .......................................... 19 6.4 p ower consumptions ................................................... ................................................... ................. 19 7. recommended temperature reflow profile.......... ............................................... 20 8. packaging information .......................... ................................................... .......................... 21
http://www.buddies-tech.com BTM61 datasheet 4 1. introduction the BTM61 bluetooth ? module is a perfect solution for enhanced audio ap plications, such as headphones and handsfree. it can be connected wi th any bluetooth ? devices in an operating range. it is slim and light so the design ers can have better flexibilities for the product shapes. the BTM61 bluetooth ? module complies with bluetooth ? specification version 3.0. it supports hsp, hfp, a2dp(mono) profiles. it integrat es rf baseband controller, antenna, etc. and provide uart interface, programmable i/o, speaker output, microphone input,? etc. the detail information of BTM61 bluetooth ? module is presented in this document below. 1.1 block diagram bc6145 eeprom +3v3
http://www.buddies-tech.com BTM61 datasheet 5 1.2 features small overall dimension(25mm x 35mm x 2mm) bluetooth specification v3.0 class 2 and class 3 support physical connection as smd type built-in rf combo filter, integrated 26m crystal. support hsp, hfp, a2dp(mono) profile. compatible with csr cvc software echo cancellation solution. no radio signal interference, support for 802.11 co -existence some features are optional for customization on dem and.
http://www.buddies-tech.com BTM61 datasheet 6 1.3 application automobile hands-free applications high quality mono bluetooth headsets bluetooth speakers(mono)
http://www.buddies-tech.com BTM61 datasheet 7 2. general specification bluetooth specification chip set csr bc6145 (rom) module id BTM61 bt standard bluetooth ? v3.0 rf tx output power 4dbm (class ii) sensitivity -86dbm@0.1%ber frequency band 2.402ghz~2.480ghz ism band baseband crystal osc 26mhz hopping 1600hops/sec, 1mhz channel space rf input impedance 50 ohms major interface microphone : input (differential) speaker : output (differential) pcm : output uart : tx/rx pios antenna profile hsp, hfp, a2dp voice processor 64mips kalimba with cvc support power supply voltage 3.0v ~ 3.6v dc working current 35ma typical, depends on profiles standby current <1ma operating environment temperature -20oc to +70oc humidity 10%~90% non-condensing environmental rohs compliant
http://www.buddies-tech.com BTM61 datasheet 8 3. physical characteristic dimension: top view: figure 2 figure 3 figure 4 pin definition:
http://www.buddies-tech.com BTM61 datasheet 9 3.1 pin description pin# pin name pad type description 1 mic_a_n analogue microphone input negative, left 2 mic_a_p analogue microphone input positive, left 3 mic_b_n analogue microphone input negative, right 4 mic_b_p analogue microphone input positive, right 5 mic_bias analogue microphone bias 6 aio[0] bi-directional vdd/low-voltage regulator output analogue programmable input/ output line circuitry and 1.5v regulated output (from internal low-voltage regulator) 7 aio[1] bi-directional vdd/low-voltage regulator output analogue programmable input/ output line circuitry and 1.5v regulated output (from internal low-voltage regulator) 8 +1v8 power high-voltage linear regulator output (1.8v out) 9 +3v3 power supply positive supply for bt module(3.0v~3.6v) 10 uart_rx cmos input with weak internal pull-down uart data input 11 uart_rts bi-directional cmos output, tri-state, with weak internal pull-up uart request to send active low 12 uart_tx bi-directional cmos output, tri-state, with weak internal pull-up uart data output 13 uart_cts cmos input with weak internal pull-down uart clear to send active low 14 gnd ground digital ground 15 led_0 open drain output led driver 16 led_1 open drain output led driver 17 pio_0 bi-directional with programmable strength internal pull-up/down programmable input/output line 18 pio_1 bi-directional with programmable strength internal pull-up/down programmable input/output line 19 pio_2 bi-directional with programmable strength internal pull-up/down programmable input/output line 20 pio_3 bi-directional with programmable strength internal pull-up/down programmable input/output line
http://www.buddies-tech.com BTM61 datasheet 10 21 pio_4 bi-directional with programmable strength internal pull-up/down programmable input/output line 22 pio_5 bi-directional with programmable strength internal pull-up/down programmable input/output line 23 vdd_chg charger input lithium ion/polymer battery charger input (4.5v~6.5v) 24 vregenable analogue take high to enable high-voltage linear regulator and switch-mode regulator 25 gnd ground digital ground 26 spi_miso cmos output, tri-state, with weak internal pull-down spi data output 27 spi_csb input with weak internal pull-up chip select for serial peripheral interface (spi),active low 28 spi_clk input with weak internal pull-down spi clock 29 spi_mosi cmos input, with weak internal pull-down spi data input 30 pio_6 bi-directional with programmable strength internal pull-up/down programmable input/output line 31 pio_7 bi-directional with programmable strength internal pull-up/down programmable input/output line 32 pio_8 bi-directional with programmable strength internal pull-up/down programmable input/output line 33 pio_9 bi-directional with programmable strength internal pull-up/down programmable input/output line 34 pio_10 bi-directional with programmable strength internal pull-up/down programmable input/output line 35 vbat vdd positive supply for bt module(3.0v~3.6v) 36 gnd ground digital ground 37 rf_io rf rf out 38 gnd ground digital ground 39 gnd ground digital ground 40 pio_11 bi-directional with programmable strength internal pull-up/down programmable input/output line 41 pio_13 bi-directional with programmable strength internal pull-up/down programmable input/output line
http://www.buddies-tech.com BTM61 datasheet 11 42 pio_14 bi-directional with programmable strength internal pull-up/down programmable input/output line 43 pio_15 bi-directional with programmable strength internal pull-up/down programmable input/output line 44 spk_b_n analogue speaker output negative, right 45 spk_b_p analogue speaker output positive, right 46 spk_a_n analogue speaker output negative, left 47 spk_a_p analogue speaker output positive, left 48 agnd analogue analogue ground
http://www.buddies-tech.com BTM61 datasheet 12 4. reference schematic figure 5
http://www.buddies-tech.com BTM61 datasheet 13 5. physical interface 5.1 power supply the transient response of the regulator is importan t. if the power rails of the module are supplied from an external voltage source, the trans ient response of any regulator used should be 20 s or less. 5.2 audio interfaces audio interface as following features: mono analogue input for voice band and audio band mono analogue output for voice band and audio band the mono audio codec uses a fully differential arch itecture in the analogue signal path, which results in low noise sensitivity and good pow er supply rejection while effectively doubling the signal amplitude. it uses a minimum of external components.the module features a differential mono audio output interface s. 5.2.1 adc the adc consists of a second order digma delta conv erter as show in figure 6. figure 6
http://www.buddies-tech.com BTM61 datasheet 14 5.2.2 adc sample rate selection and warping adc supports the following sample rates: 8khz, 11.0 25khz, 16khz, 22.05khz, 24khz, 32khz. one of the main concerns for mono wireless music ap plications is the ability to keep sampl rates for the codecs at both ends of the wireless l ink in synchronization. a vm function adjusts the sample rate using a ?warping? function to tune the sample rate to the required value. the adc warp function allows the sample r ate to be changed by +/-3%, in steps of 1/2 17 , or 7.6ppm. the warp function preserves the s ignal quality ? the distortion introduced when warping the sample rate is negligible. 5.2.3 adc gain the adc contains two gain stages for each channel, an analogue and a digital gain stage. 5.2.4 dac the dac contains two second order sigma delta conve rters allowing two separate channels that are identical in functionality as sho w in figure 6 . 5.2.5 dac sample rate selection and warping each dac supports the following sample rates: 8khz, 11.025khz, 16khz, 22.05khz, 24khz, 32khz. one of the main concerns for the dac used in stereo wireless music applications is the ability to keep sampl rates for the codecs at both ends of the wireless link in synchronization. a vm functio n adjusts the sample rate using a ?warping? function to tune the sample rate to the r equired value. the adc warp function allows the sample rate to be changed by +/ -3%, in steps of 1/2 17 , or 7.6ppm. the warp function preserves the signal quality ? th e distortion introduced when warping the sample rate is negligible. 5.2.6 dac gain the dac contains two gain stages for each channel, a digital and an analogue gain stage. 5.2.7 mono operation mono operation is single channel operation of the m ono codec. the left channel represents the single mono channel for audio i n and audio out. in mono operation the right channel is auxiliary mono channel that may be used in dual mono channel operation.
http://www.buddies-tech.com BTM61 datasheet 15 5.2.8 audio input stage the audio input stage of the module consists of a low noise input amplifier, which receives its analogue input sig nal from pins mic_a_p and mic_a_n to a second?order - ? adc that outputs a 4mbit/sec single-bit stream int o the digital circuitry. the input can be configured to b e either single ended or fully differential. it can be programmed for either microphone or line input and has a 3-bit digital gain setting of the input-amplifier in 3db steps to optimize it for the use of different microphones. 5.2.9 microphone input check the reference design in figure 5 for the microphone input design. 5.2.10 audio output stage the output digital circuitry converts the signal fr om 16-bit per sample, linear pcm of variable sampling frequency to a 2mbits/sec multi-b it stream, which is fed into the analogue output circuitry. the output circuit comprises a digital to analogue converter with gain setting and output amplifier.its class-ab output-stage is capable of d riving a signal on both channels of up to 2v pk-pk- differential into a load of 16 . the output is available as a differential signal between spk_r_p and spk_r_n for the left channel. t he output is capable of driving a speaker directly if its impedance is at least 8 if only one channel is connected or an external regulator is used. the gain of the output stage is controlled by a 3-b it programmable resistive divider, which sets the gain in steps of approximately 3db. the multi-bit stream from the digital circuitry is low pass filtered by a second order bi-quad filter with a pole at 20khz. the signal is then amplified in the fully differential output stage, which has a gain bandwidth of typical ly 1mhz. 5.3 rf interface the module integrates a balun filter. the user can connect a 50ohms antenna directly to the rf port. 5.4 general purpose analog io the general purpose analog ios can be configured as adc inputs by software. do not connect them if not use. 5.5 general purpose digital io there are nine general purpose digital ios defined in the module. all these gpios can be configured by software to realize various functions , such as button controls, led displays or interrupt signals to host controller, etc. do no t connect them if not use.
http://www.buddies-tech.com BTM61 datasheet 16 5.6 serial interfaces 5.6.1 uart this is a standard uart interface for communicating with other serial devices. the uart interface provides a simple mechanism for communica ting with other serial devices using the rs232 protocol. when the module is connected to another digital dev ice,uart_rx and uart_tx transfer data between the two devices. the remainin g two signals, uart_cts and uart_rts, can be used to implement rs232 hardware f low control where both are active low indicators. note: the serial port interface(uart)can be used fo r system debugging.don?t support to use command set for profile function app lication by uart,such as hfp/a2dp/avrcp and so on.these profiles function ap plication can be contolled only by pio,such as pairing/connect/answer/play/pau se/next/previous function application and so on. 5.6.2 spi the synchronous serial port interface (spi) can be used for system debugging. it can also be used for in-system programming for the flash memory within the module. spi interface uses the spi_mosi, spi_miso, spi_csb and spi_clk pi ns. testing points for the spi interface are reserved on board in case that the fi rmware shall be updated during manufacture. the module operates as a slave and thus spi_miso is an output of the module. spi_miso is not in high-impedance state when spi_cs b is pulled high. instead, the module outputs 0 if the processor is running and 1 if it is stopped. thus the module should not be connected in a multi-slave arrangeme nt by simple parallel connection of slave spi_miso lines. figure 7
http://www.buddies-tech.com BTM61 datasheet 17 6. electrical characteristic 6.1 absolute maximum rating rating min max unit storage temperature -40 +105 c operating temperature -20 +70 c pio/aio voltage -0.4 +3.6 v +3v3 voltage -0.4 +3.6 v usb_dp/usb_dn voltage -0.4 +3.6 v other terminal voltages except rf -0.4 3v3+0.4 v 6.2 recommended operating conditions operating condition min typical max unit operating temperature range -20 -- +70 c +3v3 voltage +3.0 +3.3 +3.6 v 6.3 input/output terminal characteristics 6.3.1 digital terminals supply voltage levels min typical max unit input voltage levels vil input logic level low - 0.3 - +0.25x3v3 v vih input logic level high 0.625*3v3 - 3v3+0.3 v output voltage levels v ol output logic level low, l ol = 4.0ma - - 0.125 v v oh output logic level high, l oh = -4.0ma 0.75x3v3 - 0.625x3v3 v input and tri-state current ii input leakage current at vin=+3v3 or 0v -100 0 100 na ioz tri-state output leakage current at vo=+3v3 or 0v -100 0 100 na with strong pull-up -100 -40 -10 a with strong pull-down 10 40 100 a with weak pull-up -5 -1.0 -0.2 a with weak pull-down 0. 2 +1. 0 5.0 a i/o pad leakage current -1 0 +1 a ci input capacitance 1. 0 - 5.0 pf resistive strength table 1 table 2
http://www.buddies-tech.com BTM61 datasheet 18 rpuw weak pull-up strength at +3v3-0.2v 500k - 2m rpdw weak pull-up strength at 0.2v 500k - 2m rpus strong pull-up strength at +3v3-0.2v 10k - 50k rpds strong pull-up strength at 0.2v 10k - 50k 6.3.2 internal codec - analogue to digital convert er paramet e r min typical max unit res o l u tion - - 1 6 bits inp u t sa m p le rate 8 - 32 khz signal / noise, f in =1khz, bw=20hz->20khz a- weighted thd+n<1% 150mv vpk-pk f sa m p le = 8 k hz - 79 - db f sa m p le = 11 . 0 2 5khz - 77 - db f sa m p le = 1 6 k h z - 76 - db f sa m p le = 22 . 0 5 khz - 76 - db f sa m p le = 3 2 k h z - 7 5 - db digi t al g a in - 24 - 21 . 5 db 6.3.3 internal codec - digital to analogue convert er paramet e r min typical max unit res o l u tion - - 1 6 bits o u t p ut sa m p le r a te, fsa m ple 8 - 32 k h z signal / noise, f in =1khz, bw=20hz- >20khz a-weighted thd+n<0.01% 0dbfs s i g n al load - 1 0 0k f sa m p le = 8 k hz - 95 - db f sa m p le = 11 . 0 2 5khz - 95 - db f sa m p le = 1 6 k h z - 95 - db f sa m p le = 22 . 0 5 khz - 95 - db f sa m p le = 3 2 k h z - 95 - db digi t al g a in - 24 - 21 . 5 db 6.3.4 microphone input microphone input min typical max unit inp u t fu l l s c a l e at m axi m u m ga i n - 4 - m v r m s inp u t fu l l s c a l e at m i ni m u m gi a n (differ e nt i al) 8 0 0 - m v r m s g ain - 3 - 42 db gain re s o l u t io n - 3 - db distort i on at 1 k hz - - - 74 db 3db b a ndw i d t h - 20 khz inp u t i m peda n ce - 6 k thd+n ( m icro p h o ne i n p u t ) @30 m v r m s in p u t - 0. 0 4 - % table 3 table 4 table 5 table 6
http://www.buddies-tech.com BTM61 datasheet 19 6.3.5 speaker output speaker driver min typical max unit out p ut v o lt ag e fu l l sc a l e s w ing (differential) - 750 - mv r m s thd+n 10 0 k load - - 0.01% % thd+n 16 load - - 0.1% % snr(load=16 , 0dbfs input relative to d i g it a l sile n ce) - 95 - db 6.4 power consumptions operating condition min typical max unit connected idle (sniff 1.28 secs) 0. 1 9 ma connected with audio streaming 30 35 40 m a deep sleep idle mode 60 ua table 7 table 8
http://www.buddies-tech.com BTM61 datasheet 20 7. recommended temperature reflow profile the soldering profile depends on various parameters necessitating a set up for each application. the data here is given only for guida nce on solder reflow.
http://www.buddies-tech.com BTM61 datasheet 21 8. packaging information 1. bluetooth ? module: BTM61 2. assembly 3. dimension all rights are strictly reserved. any portion of th is paper shall not be reproduced, copied, or translated to any other forms without permission fr om buddies technology limited.

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